Assembly Partner

Our Assembly Partner provides services in printed circuit board assembly, including:

Technologies Offered:

• MicroBGA and Flip Chip assembly and rework down to 0.007"(0.16 mm) pitch
• 0201/ LLC component placement
• Large BGA 3" x 3" upto 2500 balls placement and rework.
• In-house HP5DX 3D X-ray inspection
• In-house Flying Probe testing for PCB assemblies
• In-house BGA replacement and reball
• Box Build
• DFM and DFT

Services Offered:

• Turnkey service including PCB, component, enclosures, packaging materials procurement
• Quick-turn PCB assembly
• 0201/BGA/uBGA/ LLP/ CSP/ Flip Chip installation and rework
• Testing services including flying probe testing and ICT
• 3D x-ray inspection for failure analysis
• RMA hub
• Press fit assembly, Cabel assembly
• Burn In Testing, Full Functional In-Circuit Testing, RF Testing and Calibration
• ISO-9000 certified:each of your instructions will be documented and followed faithfully. If there is a small doubt, we always ask! Procedures are maintained throughout the process to ensure each jobs are performed correctly. Quality assembly is always on the top of our priorities.